march 2017 doc030246 rev 1 1 / 10 this is information on a product in full production. www.st.com esda17p100 - 1u2m high power transient voltage suppressor datasheet - production data features ? low clamping voltage ? peak pulse power: 4800 w (8/20 s) ? stand-off voltage 15 v ? unidirectional diode ? low leakage current: 0.2 a at 25 c ? complies with iec 61000-4-2 level 4 ? 30 kv (air discharge) ? 30 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required, such as: ? smartphones, mobile phones, tablets, portable multimedia ? usb v bus protection ? power supply protection ? battery protection description the ESDA17P100-1U2M is a unidirectional single line tvs diode designed to protect the power line against eos and esd transients. the device is ideal for applications where high power tvs and board space saving is required. figure 1: pin configuration table 1: device summary pin name description 1 v bus v bus pin 2, 3, 4 nc non connected pin 5, 6 gnd ground pin tab gnd ground pin qfn package
characteristics esda17p100 - 1u2m 2 / 10 doc030246 rev 1 1 characteristics table 2: absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000 - 4 - 2: contact discharge air discharge >30 >30 kv p pp peak pulse power 8/20s 4800 w i pp peak pulse current 8/20s 160 a t stg storage junction temperature range - 55 to + 150 c t op operating junction temperature range - 55 to + 150 figure 2: electrical characteristics (definitions) table 3: electrical characteristics (t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 15.7 16.5 17.7 v v rm 15 v i rm v rm = 12 v 100 na i rm v rm = 15 v 200 na r d 8/20 s 0.07 v cl i pp = 100 a, 8/20 s 24 26 v v cl i pp = 160 a, 8/20 s 28 30 v c bus v bus = 0 v, f = 1 mhz, v osc = 30 mv 1200 pf
esda17p100 - 1u2m characteristics doc030246 rev 1 3 / 10 1.1 curves figure 3 : peak power dissipation versus initial temperature (typical value) figure 4 : peak pulse power versu s exponential pulse duration (t j = 25 c, typical value) figure 5 : peak pulse current versus clamping voltage (max. value) figure 6 : leakage current versus junction temperature (typical value) figure 7 : esd response to iec 61000 - 4 - 2 (+8kv contact discharge) figure 8 : esd response to iec 61000 - 4 - 2 ( - 8kv contact discharge) 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 20 40 60 80 100 120 140 160 t j (c) 8/20 s typical value p pp (w) 10 100 1000 10000 10 100 1000 t p (s) t j initial = 25 c typical value p pp (w) 0.1 1 10 100 16 18 20 22 24 26 28 30 v cl (v) 8/20 s t j initial = 25 c i pp (a) 0 50 100 150 200 250 300 0 20 40 60 80 100 120 140 160 t j (c) v r = 12 v and 15 v reverse typical value i r (na) v r = 12 v v r = 15 v 5 v/div 7.7 v 20 ns/div v : esd peak voltage pp v : clamping voltage @ 30 ns cl v : clamping voltage @ 60 ns cl v : clamping voltage @ 100 ns cl 1 1 2 2 3 4 3 25.4 v 4 8 v 6.9 v 5 v/div -1.2 v 20 ns/div v : esd peak voltage pp v : clamping voltage @ 30 ns cl v : clamping voltage @ 60 ns cl v : clamping voltage @ 100 ns cl 1 1 2 2 3 4 3 -23.5 v 4 -1.6 v -997 v
package information esda17p100 - 1u2m 4 / 10 doc030246 rev 1 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 qfn1610 figure 9: qfn package outline top view side view bottom view d e a a3 a1 e2 k l e3 e1 b d2 e2 pin #1 id
esda17p100 - 1u2m package information doc030246 rev 1 5 / 10 table 4: qfn package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.51 0.55 0.60 0.0201 0.0217 0.0236 a1 0.00 0.02 0.05 0.0000 0.0008 0.0020 a3 0.15 b 0.15 0.20 0.25 0.0059 0.0079 0.0098 d 1.70 1.80 1.90 0.0669 0.0709 0.0748 e 1.90 2.0 2.10 0.0748 0.0787 0.0827 e1 0.4 0.0157 e2 0.80 0.0315 d2 0.30 0.45 0.55 0.0118 0.0177 0.0217 e2 0.69 0.84 0.94 0.0272 0.0331 0.0370 e3 0.95 0.0374 k 0.28 0.0110 l 0.20 0.030 0.40 0.0079 0.0118 0.0157 n 6.00 figure 10 : qfn footprint
package information esda17p100 - 1u2m 6 / 10 doc030246 rev 1 figure 11 : marking product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 12 : tape and reel specification (in mm) d
esda17p100 - 1u2m recommendation pcb doc030246 rev 1 7 / 10 3 recommendation pcb 3.1 stencil opening 1. general recommendation on stencil opening design a. stencil opening dimensions: l (length), w (width), t (thickness). 2. general design rule a. stencil thickness (t) = 75 ~ 125 m b. aspect ratio = ? ? 1.5 c. aspect area = ?? 2? ( ?+? ) 0. 66 3. reference design a. stencil opening thickness: 100 m b. stencil opening for leads: opening to footprint ratio is 90%. figure 13 : stencil opening dimensions figure 14 : recommended stencil window position
recommendation pcb esda17p100 - 1u2m 8 / 10 doc030246 rev 1 3.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std- 004. 2. no clean solder paste is recommended. 3. offers a high tack force to resist component movement during pcb movement. 4. solder paste with fine particles: powder particle size is 20- 45 m. 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. a symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. 3.5 reflow figure 15 : st ecopack? recommended soldering reflow profile for pcb mounting minimize air convection currents in the reflow oven to avoid component movement.
esda17p100 - 1u2m ordering information doc030246 rev 1 9 / 10 4 ordering information figure 16 : ordering information scheme table 5: ordering information order code marking (1) package weight base qty. delivery mode esda17p100 - 1u2m d qfn 6 mg 5000 tape and reel notes: (1) the marking can be rotated by multiples of 90 to differentiate assembly location 5 revision history table 6: document revision history date revision changes 14 - mar - 2017 1 initial release. esda 17 p100 - 1u2 m esd array breakdown voltage 17 = 17 v typ. i pp 8/20 s direction 1u2 = 1 unidirectional line package m = qfn p100 = 100 a
esda17p100 - 1u2m 10 / 10 doc030246 rev 1 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, enhancements, modifications , and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of or der acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and s t assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information se t forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2017 stmicroelectronics C all rights reserved
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